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LDM-4984 Series butterfly laser diode mounts provides a compact, easy-to-use solution for laser diode fixturing. Zero insertion force (ZIF) sockets and spring-loaded clamps facilitate ease of mounting. They feature our standard 9-pin D-sub input connectors with configurable pin designations to accommodate virtually any laser diode pin configuration.
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LDM-4984 Laser Diode Mount, 14-pin Butterfly | 0.0 | 0.0 | 14-pin Butterfly | No |
In Stock
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$810.00 |
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ILX Lightwave | ||||
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LDM-4984T Laser Diode Mount, 14-pin Butterfly, Temp Controlled | 0.0 | 0.0 | 14-pin Butterfly | Yes |
4 Weeks
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$1,090.00 |
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ILX Lightwave |
Models |
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Product Series Overview
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$1,090.00
4 Weeks
Product Series Overview
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Laser Current | 2 A | 2 A |
Laser Driver Connector Type | Female 9-pin DSUB | Female 9-pin DSUB |
TE Cooler | No | Yes |
TE Current Range | -6.0 to +6.0 A | |
TE Voltage Range | -4.2 to +4.2 V | |
Temperature Range | -5 to 85°C | |
Temperature Sensor | None | 10 kΩ NTC Thermistor |
TEC Controller Connector Type | Male 9-pin DSUB | Male 9-pin DSUB (TEC) / 9-pin DSUB (Case TEC) |
All standard mounts in the LDM-4980 series feature fully configurable laser and temperature control connections. This allows the flexibility to accommodate virtually any laser diode pin configuration. In addition, these mounts have the ILX Lightwave® standard 9-pin D-sub input connections to make setup and configuration consistent and easy.
The LDM-4984T version is equipped with an external case temperature control option. The external case temperature control allows for control of laser package temperature, resulting in simultaneous and independent temperature control of both laser die temperature and package temperature. It is ideal for applications requiring tight temperature stability, different case temperatures, or for testing laser diodes at a wider temperature range than can be accomplished with the internal TEC alone.
The LDM-4984 mounts allow simple case clamping and electrical connection using a single flat ZIF socket to facilitate ease of mounting and to minimize strain on device leads. Once installed in the socket and clamped, the entire laser package bottom surface is clamped to a heat sink.
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