Flexible Printed Circuits

As the name implies, a flexible printed circuit, or “FPC,” is a circuit board that is flexible and can be bent, twisted and even folded to a certain extent. By comparison, the more familiar type of PCB, a rigid PCB, cannot be bent, twisted or folded. FPCs can be used in a countless number of applications and are having a dramatic effect on the digital transformation of practically every aspect of our lives. For example, they can help continue the trend of consumer electronics becoming even smaller, more powerful and more useful, such as with bendable smart phones. FPCs are important for the automotive industry as cars become more automated. They’re also critical in the medical and healthcare fields, as they can, for example, advance implantable and wearable device capabilities. And with the rollout of 5G and the Internet of Things, the demand for FPCs will grow even further. This is just a portion of the applications and industries that FPCs can be used in, as they can also be used extensively in aerospace, robotics, AR/VR and many others.

Lasers and Processing of FPCs

Lasers are widely used in the processing of flexible circuit boards for operations such as singulation, or depaneling, coverlay patterning, and drilling holes and vias. But, not all lasers are the same.

UV Short-Pulse Lasers Provide Advantages over CO2 Lasers

The optimal lasers to use for FPC processing are UV, or ultraviolet, wavelength lasers with short pulses and high repetition pulse rates. Shorter laser wavelengths allow smaller beam spot sizes and tighter focusing, which is beneficial for FPC processing in a number of ways:

  • Higher precision operations
  • Achieve smaller dimensions for even more flexibility and miniaturization
  • Less material wasted, allowing more circuits to fit on a panel

Such results are not possible with longer-wavelength lasers, such as CO2 lasers. Only the tighter focus provided by shorter wavelength UV lasers provide beam spot sizes sufficiently small for drilling the required hole dimensions that will enable further miniaturization of FPCs.

Figure 1. Profile of a via hole drilled in flex-PCB using a Spectra-Physics Talon UV ns laser. The flex-PCB layer is a Cu/PI/Cu laminate. The via hole was trepan cut with an 80 μm diameter. The resulting average burr height was < 2 μm.

Lasers with short pulses and, in combination, higher repetition rates are advantageous because in general, the shorter, or faster, the pulse, the higher the quality of a cut or drill will be. Shorter pulse widths can deliver intense peak powers resulting in:

  • Nonlinear absorption at the sample for instantaneous material vaporization
  • Very minimal heat transfer into the material
  • Much smaller heat-affected zone, or HAZ
  • Higher throughput and fewer part failures

While most commercially available pulsed CO2 lasers have pulse widths in the millisecond or microsecond range and repetition rates up to a few hundred kHz, by contrast, Spectra-Physics UV diode-pumped solid state lasers feature pulse widths in the nanosecond range and rep rates up to 500 kHz.

Another feature that can be provided by Spectra-Physics UV diode-pumped solid state lasers is high power. This allows faster operations, such as cutting, which results in higher yields and meeting the throughput requirements for FPC processing. At the same time, it is important to note that the quality of the operation will not be sacrificed for speed due to the benefits provided by the shorter pulse widths and high repetition rates.

UV wavelengths also contribute to efficient processing, as they are well absorbed by a variety of materials in FPCs, including copper and polyimide. Thus, the high beam intensity with smaller beam spot sizes achievable with UV wavelengths that Spectra-Physics lasers offer can efficiently remove copper, while a lower beam intensity with the same type of laser can cut dielectric material without damaging the bottom copper layer.

Figure 2. Representation of a 2-step blind via-drilling process in a common FPC laminate

MKS Solutions for Flexible Printed Circuit Processing

MKS has many solutions to help meet the current and future flexible printed circuit board manufacturing challenges.

The first challenge that often comes to mind is maximizing throughput and yield. MKS offers UV and green short-pulsed lasers, including high power lasers with pulse control, that can be used for singulation or depaneling, coverlay patterning, and drilling both blind via holes and through-vias. We believe that UV lasers are superior to longer-wavelength CO2 lasers for FPC processing. To ensure that the laser system is performing optimally, MKS offers fast laser measurement and profiling instruments. To manage the high power lasers, MKS also provides high power/high fluence optics for optimal results. And to position components for a process quickly and accurately, MKS can provide high-speed, high-precision motorized positioners.

Another challenge is to improve the quality and reliability of FPCs. Our nanosecond and ultrafast lasers can provide the cleanest cuts and drills with the least amount of thermal and other damage, leading to higher quality and reliability. Additionally, MKS' optical mounts are very robust and stable, so that laser performance will not decline easily over time.

As flexible circuit boards are becoming more and more miniaturized, drilling vias, depaneling and coverlay patterning all become more challenging. The smaller beam spot sizes enabled by the short wavelengths of UV lasers that MKS provides can meet the smaller dimensional requirements presented by miniaturized FPCs.

Challenges in Flex Circuit Manufacturing MKS Solutions
Maximizing throughput & yield UV short-pulsed lasers for high speed, yield and precision micromachining
Fast, high power laser measurement and profiling
High power/high fluence optics to manage the lasers
High speed and precision motorized positioners
Improving quality and reliability Nanosecond and ultrafast lasers for highest quality micromachining
Robust, stable optical mounts
Miniaturization of FPCs UV lasers for smaller beam spot sizes

Your Partner for Flexible Printed Circuit Processing

  • 50+ years and thousands of alignment systems for optical applications
  • Long-term partner to semiconductor manufacturing companies
  • Full range of products: lasers, optics, motion, opto-mechanics, beam analysis
    • Custom capabilities
    • Product availability
  • Ability to scale with you
  • Global corporation and presence

Lasers

Beam Analysis

Motion Control

Opto-Mechanics
  • UV and green lasers
  • Nanosecond and ultrafast lasers
  • DPSS Q-switched lasers
  • High power laser thermal sensors
  • High power beam profilers
  • Laser power/energy meters
  • Full range of motorized stages
  • Motion controllers
  • Manual Positioners
  • Custom assemblies
  • High-energy Optics
  • UV, visible and IR optics
  • CO2 lenses
  • Mirror mounts
  • Lens positioners

Lasers

Criteria for Selecting Lasers

  • Application Requirements
    • Function
    • Type of Material & Thickness
    • Speed
    • Resulting Size of Heat Affected Zone (HAZ)\
  • Laser Specifications
    • Wavelength
    • Power
    • Pulse Width & Repetition Rate
    • Stability
  • MKS Laser Applications in FPC
    • Hole and via drilling
    • Singulation (depaneling)
    • Coverlay patterning

Lasers for Flexible Printed Circuits

  Talon
Talon
Talon Ace
Talon Ace
IceFyre
IceFyre
Wavelengths UV or Green UV UV
Power UV: Up to >45 W
Green: Up to >70 W
>100 W Up to >50 W
Pulse Width UV: <25 or 40 ns
Green: <25 or 43 ns
<2 to >50 ns <12 ps (10 ps typical)
Repetition Rates 0 to 500 kHz Single shot to 5 MHz Single Shot to 10 MHz
Max Pulse Energy UV: Up to >500 µJ
Green: Up to 1000 µJ
Up to >500 µJ Up to >60 µJ
Other Features Laser/controller in single, compact package
24/7 industrial reliability
E-Pulse™ technology for superb stability
24/7 industrial reliability
TimeShift™ technology for pulse control
Laser/controller in single, compact package
24/7 industrial reliability
TimeShift™ technology for pulse control Laser/controller in single, compact package

Flexible Printed Circuit Laser Selection Guide

Presented here is a summary of recommended lasers for various flexible PCB manufacturing applications. Please use this as a reference guide only, and always contact us to discuss your application and requirements in detail so that we may provide the best solution for you. 

  Talon® Talon® Ace™ IceFyre®
Speed / Throughput ✓✓ ✓✓✓ ✓✓
Quality of cut or drill (HAZ, burrs, residue) ✓✓ ✓✓✓
Operational Flexibility ✓✓ ✓✓✓ ✓✓✓
Blind via drill examples
Left: Entrance of hole
Right: Bottom of hole
Entrance = 24 µm, Exit = 10 µm
Entrance = 50 µm
Exit = 35 µm
Entrance = 30 µm
Exit = 20 µm

Laser Beam Analysis

Even with the advantages that lasers have over traditional tools, laser systems can still degrade over time. Some causes of degradation include thermal effects on a laser system’s internal components, vibrations or shock and debris near the processing site. These issues could affect laser performance in a number of ways. First, output power may be reduced, causing the laser to be less efficient. Another problem that may be caused is a change in the focus or other profile of the beam, which may lead to a cut or drill to be off target, too deep, low quality or possibly damaging to another part of the material.

Therefore, to ensure the highest quality flexible printed circuits manufacturing and to minimize the possibility of production down-time, it is crucial to monitor the laser beam frequently with appropriate instruments–like Ophir® power sensors, power meters and beam profilers–that can operate at the laser’s wavelength while handling its maximum output power level.

Causes of Laser System Degradation

  • Thermal Effects
  • Debris from Process
  • Vibrations and Shock
Figure 1. As the laser emerges from the laser source (left), it runs through a variety of laser delivery components, such as free-space optics and process fibers, which can change the power levels and beam profile (center). The laser beam next moves through the laser processing head. Mirrors and lenses and cover glass can also have a significant impact on power levels, size, and shape (right).

Criteria for Beam Analysis Instruments

There are three types of beam analysis instruments to monitor your laser: (1) sensors and detectors to measure power, (2) power meters to process the information provided by sensors and (3) beam profilers to determine focus position and other beam characteristics. Shown below are the main criteria for choosing such instruments.

Laser Sensors
  • Compatible with laser wavelength
  • Power/energy range/density
  • Beam size
  • Calibrated power measurement
Power Meters
  • Compatible with sensor
  • Connect to system/PC
  • Track process data over time
  • Compare multiple measurements at once
Beam Profilers
  • Measurement of multiple attributes
    • Focal shift
    • Focal spot size
    • Laser power and power density
    • Changes over time
    • Laser propagation characteristics
  • Speed of measurement

Laser Power Sensors

MKS offers a comprehensive portfolio of Ophir® laser thermal power sensors, several of which can measure the optical output power of short- and ultrashort-pulsed lasers such as IceFyre, Talon, Talon Ace and Quasar. These sensors have a very high damage threshold to withstand the high optical peak power delivered by each pulse. Ophir sensors and meters meet the ISO/IEC 17025 standard for calibrated devices.

  F150(200)A-CM-16 30(150)A-SV-17 F80(120)A-CM-17  
Spectral Range 0.248-9.4 µm 0.19-11 µm 0.248-9.4 µm laser-power-energy-meters
Power Range 300 mW - 200 W 100 mW - 150 W 100 mW - 120 W
Energy Range 50 mJ – 200 J 50 mJ – 300 J 50 mJ – 200 J
Max Avg Power Density 35 kW/cm2 60 kW/cm2 35 kW/cm2
Max Energy Density (2 msec) 45 J/cm2 50 J/cm2 45 J/cm2
Aperture Ø16 mm Ø17 mm Ø17.5 mm
Response Time 3 sec 1.7 sec 2 sec
Other Features Not water-cooled

Power Meters

Ophir laser power and energy meters work on the smart plug principle. This means that almost any power meter can work – plug and play – with almost any of the wide range of Ophir optical sensors.

 

 

Power Meters Virtual Power Meters
centauri
Centauri
StarBright
StarBright Handheld
Juno+
Juno+
EA-1
EA-1
  • Extensive graphic displays on 7-in full color touchscreen display
  • Advanced measurement processing
  • Single- or dual-channel versions
  • USB and RS-232 interfaces, with user-friendly software application
  • Analog and TTL output
  • External trigger input
  • Portable use
  • For transmission checks "in the field"
  • Variety of measurement modes and displays
  • USB & RS-232 interfaces
  • USB connection to use PC as monitor
  • User-friendly software
  • Extensive graphic displays of data
  • Advanced measurement processing
  • Data logging
  • Ethernet adapter enables remote control and monitoring of sensor
  • Telnet, HTTP and UDP protocols supported
  • Interact with sensor through custom software or MKS user-friendly software
  • Data logging

Beam Profilers

An effective way to analyze beam profile is with a camera-based system. Ophir beam profiling cameras allow real-time viewing and measuring of a laser’s structure in high resolution. Camera-based systems can also measure cross-sectional intensity of the laser and provide a complete 2-dimensional view of the laser mode.

  SP932U
SP932U
SP932U
Pyrocam™ IV
NanoScan
NanoScan™
Spectral Range 190-1100 nm 13-355 nm, 1.06-3000 µm 190 nm-100 µm
Power Range     5 mW to 100 W
Damage Threshold 50 W/cm2, 1 J/cm2, <100 ns pulse width 2 W over entire array, 20 mJ/cm2 (1 ns pulse)  
Beam Sizes 34.5 µm to 5.3 mm 1600 µm to 25.4 mm 20 µm to 6 mm
Pixels 2048 x 1536 Effective Pixels, 3.45 µm Pixel Size 320 x 320 Effective Pixels, 75 µm Pixel Size  
PC Interface USB 2.0 GigE USB 2.0
Other Features BeamGage® software included
UltraCal™ correction algorithm
Measures cross-sectional intensity
72 dB true dynamic resolution
24 Hz frame rate in 12-bit mode
BeamGage® software included
CW or pulsed beams
Measures cross-sectional intensity
Graphical user interface software included
CW or >25 kHz pulsed beams

Motion Control

Galvanometer Scanners and Linear Positioners

Galvos
  • Advantages
    • Used to steer laser
    • Fast scanning (meters/sec) with sharp corners
  • Limitations
    • Limited field of view (~100-200 mm)
    • Limited focal spot size (10-20 µm)
Linear Positioners
  • Advantages
    • Used to position galvo(s)
    • Large field of view
    • Allows tight focal spots (<10 µm)
  • Limitations
    • Not as fast as galvos

Combined Galvo-Linear Positioners System

  • Combines speed of galvos with FOV allowed by positioners
  • Galvo and positioners can be synchronized with advanced motion controller
  • Enables "stitching":
    • Galvo process for "cells"
    • Positioners place next cell as target
    • Repeat galvo process
  Galvos Linear Positioners Combined System
Speed & Acceleration Fast Not as fast Fast
Field of View (FOV) Limited Large Large
Focal Spot Size Limited Tighter Tight
  • MKS offers a full range of positioners and motion controllers
  • Galvos purchased separately – MKS controllers can interface with galvos

Guaranteed Motion Control Performance

  • Stages that MKS ships meet or exceed the guaranteed specifications
  • Metrology reports included with each stage (ASME B5.57 and ISO 230-2 standards)
  • Typically, the product will perform ~2x better than the guarantee

IDL-LM Series Linear Motor Positioners

Highest load capacity and speed of all linear motor positioners for demanding production environments

Travel Range 100 to 1,200 mm
Speed 2 m/sec
Load Capacity 450 to 200 N
Pitch ±15 to ±65 µrad
Yaw ±15 to ±40 µrad
Accuracy ±2 to ±5 µm
Other Features

Ironless Linear Motor

Recirculating ball bearings

Industrial grade hard covers

IMS Series Long-Travel Aluminum Linear Positioners

High load capacity, long travel, fast movement capable of high-duty cycles in industrial applications

  Stepper Motor DC Motor
Travel Range 300 to 600 mm
Speed 100 m/sec 200 mm/sec
Load Capacity 600 N
Pitch ±37 to ±50 µrad
Yaw ±15 to ±30 µrad
Accuracy ±2.5 to ±4 µm
Other Features Double-row recirculating ball bearings
Linear motor version available

ILS Series Mid-Travel Aluminum Linear Positioners

High load capacity, mid-travel, fast movement capable of high-duty cycles in light industrial applications

  Stepper Motor DC Motor
Travel Range 50 to 250 mm
Speed 50 m/sec 100 mm/sec
Load Capacity 250 N
Pitch ±15 to ±42 µrad
Yaw ±12 to ±25 µrad
Accuracy ±0.6 to ±1.7 µm
Other Features Double-row recirculating ball bearings
Linear motor version available

Motion Controllers

XPS-D
XPS-D
XPS-RLD
XPS-RLD
  • High performance, complex motion trajectories
  • Up to 8 axes
  • Extensive analog and digital I/O
  • Can synchronize galvos and positioners
  • Best for the most demanding applications
  • High performance, complex motion trajectories
  • Up to 4 axes
  • Analog and digital I/O
  • Can synchronize galvos and positioners
  • Good for demanding R&D and low volume production

Optics

Flex-PCB lasers typically operate at 355 nm (UV) and possibly 532 nm (green). We recommend using laser line optics when possible because they’re optimized for a specific wavelength and will perform better than a broadband optic.

Criteria for Selecting Optics

  • Wavelength
  • Laser Induced Damage Threshold (LIDT)
    • Substrate Material
    • Coating
  • Reflectivity/Transmission
  • Size and Shape

High-Energy Laser Mirrors

High-energy laser mirrors optimized for 355 and 532 nm offer very high reflectivity and damage thresholds, and standard broadband metallic mirrors offer a more economic option for good performance and value over very broad spectral ranges.

  High-Energy Laser Mirrors
Wavelength 355 nm 532 nm
CW Damage Threshold 3 kW/cm2
Pulsed Damage Threshold 3.5 J/cm2 @ 10 ns, 20 Hz 10 J/cm2 @ 20 ns, 20 Hz
Reflectivity Rs > 99.7%
Rp > 99%
Diameter 1 and 2 inch
Substrate Material UV Grade Fused Silica
Angle of Incidence 45°

High-Energy Plano-Convex Lenses

High-energy lenses optimized for 355 and 532 nm offer very high transmission and damage thresholds, and standard fused silica lenses offer good performance and value over very broad spectral ranges.

  High-Energy Spherical Lenses
Wavelength 355 nm 532 nm
Pulsed Damage Threshold 15 J/cm2 @ 20 ns, 10 Hz
Average Reflectivity per Surface < 0.25%
Diameter 1 inch
Substrate Material High Purity Fused Silica

Nanotexture Surface Lenses

Highest laser damage resistance and lowest reflection loss

  Nanostructure Surface Fused Silica Plano-Convex Lenses
Wavelength 250 to 550 nm
CW Damage Threshold 15 MW/cm2
Pulsed Damage Threshold 35 J/cm2 @ 10 ns, 1064 nm
Reflection Loss 0.1%
Diameter 0.5 in.
Shapes Plano-Convex or Plano-Concave
Substrate Material High Purity Fused Silica
Other Features Sub-λ AR nanotextures etched directly into surface (no thin film coatings)

CO2 Laser Lenses

If you happen to be using CO2 lasers in your FPC processing operation, we offer low absorption lenses that are specially designed to be used with high powered 10.6 micron CO2 lasers of up to several kilowatts.

In particular, our Black Magic series features low absorption rates of less than 0.15% of laser power, and our Clear Magic series features ultra-low absorption rates of less than 0.13%, and consequently, higher transmission of the laser energy through the lens. This leads to higher efficiency, superior performance and longer lifetimes for your system.

These zinc selenide lenses are CNC manufactured for the highest accuracy, uniformity and consistency. Plano-convex and mensicus lenses with diameters from just over 1 inch to 2 inches and various focal lengths are available. And if you think a standard AR coating will be sufficient for your application, the Duralens series uses the same substrates but with a standard 10.6-micron coating.

  CO2 Laser Lenses
Coating Duralens™ Black Magic™ Clear Magic™
Wavelength 10.6 µm
Transmission >99.3% >99.35% >99.37%
Absorption <0.2% <0.15% <0.13%
Reflection <0.2% <0.25% <0.25%
Diameters 1.1 to 2.5 in. 1.1 to 2.5 in. 1.1 to 2.0 in.
Shapes Plano-Convex
Meniscus
Substrate Material ZnSe
Other Features Compatible with CO2 lasers in the kW range

High-Energy Polarizing Cube Beamsplitters

Optimized for 355, 532 and 1064 nm, these cubes offer high damage thresholds, efficient polarization, and high extinction ratio.

  High-Energy UV Polarizing Cube Beamsplitters Laser Line Polarizing Cube Beamsplitters
Wavelength 355 nm 532 nm
Pulsed Damage Threshold 5 J/cm2 10 J/cm2 
Reflectivity Rs > 99% Rs > 99.5%
Transmission Tp > 90% Tp > 95%
Extinction Ratio Tp/Ts >200:1
Size 1 in. 0.5 in.
Substrate Material UV Grade Fused Silica

Other Features

Optically contacted, no cement

Zero-Order Waveplates (λ/4 and λ/2)

Very high damage threshold, low sensitivity to temperature and wavelength variation.

  Zero-Order Waveplates
Wavelength 355 nm 532 nm
CW Damage Threshold 2 MW/cm2
Reflectivity per Surface < 0.25%
Diameter 0.5 and 1 in.
Substrate Material Quartz
Temperature Coefficient 0.0001 λ/°C
Other Features ±λ/300 retardation accuracy

Opto-Mechanics

There are many criteria to consider when selecting components, but here are the ones we think are important to start off with when you’re trying to narrow down the hundreds of choices out there for optical mounts.

First, resolution or sensitivity. How fine will the adjustments be that you’ll be making? Each mount’s resolution is determined by the threads-per-inch, or TPI, of its adjustment screws. MKS offers mounts with 50 all the way to 254 TPI. We also have a variety of drive types from high precision adjustment screws to differential micrometers.

Next, and probably the most important in the long term, is stability. Once you have your position set, you don’t want it to move. An unstable system could lead to potential downtime due to misalignment and other potential errors. One source of instability is thermal drift, which can be a real problem because a high powered laser can potentially heat up the area that that these optics are in, then heat up the object itself, which will lead to heating up the mount as well. One way to deal with thermal drift is to choose appropriate materials, and we’ve found that stainless steel mounts produce the least amount of thermal drift and shift. Other sources of instability are vibration and shock, so some mounts’ mechanical designs deal with vibration and shock better than others do.

Criteria for Selecting Optical Mounts

  • Resolution/Sensitivity
  • Long Term Stability
  • Lockable
  • Size and Shape

Optical component mounts are needed to hold and adjust optics. Long term stability and low drift is crucial. Minimizing drift caused by vibrations or thermal drift over time will ensure laser alignment to the desired spot and also reduce any potential downtime due to misalignment and errors. Having a locking mechanism on these mounts can also prevent misalignment of the beam, especially during shipping and also if anything else happens during usage.

HVM industrial mounts are recommended for robust long term usage in compact space. The Suprema® mirror mount is excellent for its stainless steel construction that gives better thermal performance than an aluminum mirror mount. Ultra-fine 254-TPI adjusters provide alignment sensitivity as low as 1.5 arc sec. For applications that are really concerned about the thermal changes that can be potentially caused by prolonged high powered laser usage, the ZeroDrift™ version will compensate for some thermal changes as well. For those mirror mounts that need to be set-and-forget for a long period of time, we recommend the MFM flexure mirror Mount. These are excellent for their small footprint so that machine size can be reduced.

  Suprema
Suprema
Suprema® ZeroDrift™

Suprema® ZeroDrift™

Optic Diameters 0.5, 1 and 2 in. 0.5 and 1 in.
Resolution 50, 100, 127 and 254 TPI 100 TPI
Angular Range ±7° ±4°
Material Stainless Steel

Stainless Steel

Drive Types Knob
Hex Key
Exchangeable Actuators
Knob
Hex Key
Lockable Versions Yes Yes
Other Versions Clear-Edge
Front- and Rear-Loading
Right- and Left-Handed
Low Wavefront Distortion
ZeroDrift™

Thermal drift compensation

Front- and Rear-Loading
  HVM-Series
HVM-Series
MFM-Series
MFM-Series
Optic Diameters 0.5, 1 and 2 in. 0.5, 0.75 and 1 in.
Resolution 80 and 100 TPI 80 and 100 TPI
Angular Range ±2.5°, ±3° and ±3.5° ±2.5°
Material Anodized Aluminum, Stainless Steel Stainless Steel
Drive Types Hex Key Hex Key
Lockable Versions Yes No
Other Features Front- and Rear-Loading Versions Shock Resistant
Front- and Rear-Loading Versions
Adhesive wells for permanent mounting
  A-Line
A-Line
Compact
Compact
LP-Series
LP-Series
Optic Diameters 0.5 to 3 in. 0.5, 1 and 2 in. 0.5, 1 and 2 in.
Resolution - 100 TPI 100 TPI
Adjustments Fixed XY, XYZ, XYZθxθy XY, XYZ, XYZθxθy
Material Aluminum Aluminum Aluminum
Other Features Self-aligning design
Large clear aperture
Compatible with A-Line alignment system
Adapters for other optics
Lockable positions
Zero-freeplay XY mechanism
True Gimbal adjustments
Independent non-influencing locks
Adapters for other optics
  UGP-1
UGP-1
RSP-Series
RSP-Series
Optic Size 0.5 and 1 in. cube 1 and 2 in.
Resolution 100 TPI 4 arc min
Angular Range ±5° 360°
Material Aluminum Aluminum
Drive Types Knob w/ Hex Hole Coarse: knurled edge
Fine: knob
Lockable Yes Yes
Other Features True gimbal motion
Adapters for other optics
Full ball bearing races
Adapters for other optics

Vibration Isolation

NewDamp™ Elastomeric Vibration Isolators

Supports and dampens high acceleration amplitudes

  NewDamp™ Elastomeric Isolators
Minimum Loads 6-45 kg
Load Capacity 8 to 200 kg (per isolator)
Loss Factor 0.5 to 0.8 in 10-100 Hz range
Height 1.32 to 3.28 in.
Base Size 2.4 x 2.4 to 4.5 x 4.5 in.
Other Features Constant natural frequency design
Fast settling times
Cleanroom compatible
Breadboard, Microlock and X95 compatible